HI Dilbert
Of course - I remember our discussions about the chemicals. I'm using an actual solvent - short name DMA - it quite successfully now, but it does destroy the outer layers of the BGA where the epoxy has penetrated, so reballing (or a new chip) is necessary).
I find your comments about overheating the chip very interesting indeed and it may be the answer I'm looking for with some chips where I have new replacements. The solvent route does work but it takes a long time - more than 1 hour - to dissolve and a lot of work with a scalpel to scrape the solft layer away.
Agreed too about the Samsung DDR2 chips whcih pop.
Onto Nivida. That information is very useful indeed for me. I read the enquirer article but seemed to miss about the problem not being the BGA to motherboard but the primary to bonding layers. In one way it makes it easier for me because I don't have to deal with dots of epoxy strips (some HP's use red strips compared with Thinkpad clear ones) and simply need to do a reflow on the chip as it is.
I'm trying to get hold of decent replacement Nvidia chips since it's a better solution than reflowing.
Can you PM me your TPF US link when you've posted there and I'll follow the thread.
Many thanks for your insites - much appreciated.
Nick
Of course - I remember our discussions about the chemicals. I'm using an actual solvent - short name DMA - it quite successfully now, but it does destroy the outer layers of the BGA where the epoxy has penetrated, so reballing (or a new chip) is necessary).
I find your comments about overheating the chip very interesting indeed and it may be the answer I'm looking for with some chips where I have new replacements. The solvent route does work but it takes a long time - more than 1 hour - to dissolve and a lot of work with a scalpel to scrape the solft layer away.
Agreed too about the Samsung DDR2 chips whcih pop.
Onto Nivida. That information is very useful indeed for me. I read the enquirer article but seemed to miss about the problem not being the BGA to motherboard but the primary to bonding layers. In one way it makes it easier for me because I don't have to deal with dots of epoxy strips (some HP's use red strips compared with Thinkpad clear ones) and simply need to do a reflow on the chip as it is.
I'm trying to get hold of decent replacement Nvidia chips since it's a better solution than reflowing.
Can you PM me your TPF US link when you've posted there and I'll follow the thread.
Many thanks for your insites - much appreciated.
Nick
