Memory --------------------------------------------------------------------
[General information]
Total Memory Size: 16 GBytes
Total Memory Size [MB]: 16384
[Current Performance Settings]
Maximum Supported Memory Clock: 1300.0 MHz
Current Memory Clock: 798.8 MHz (8 : 1 ratio)
Current Timing (tCAS-tRCD-tRP-tRAS): 11-11-11-28
Memory Channels Supported: 2
Memory Channels Active: 2
Row: 0 [BANK 0/ChannelA-DIMM0] - 8 GB PC3-14900 DDR3 SDRAM Kingston KHX318LS11IB/8
[General Module Information]
Module Number: 0
Module Size: 8 GBytes
Memory Type: DDR3 SDRAM
Module Type: SO-DIMM
Memory Speed: 933.7 MHz (DDR3-1867 / PC3-14900)
Module Manufacturer: Kingston
Module Part Number: KHX318LS11IB/8
Module Revision: 0
Module Serial Number: 3577020552 (880035D5)
Module Manufacturing Date: Year: 2024, Week: 9
Module Manufacturing Location: 0
SDRAM Manufacturer: Samsung
Error Check/Correction: None
[Module characteristics]
Row Address Bits: 16
Column Address Bits: 10
Number Of Banks: 8
Module Density: 4096 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Module Nominal Voltage (VDD): 1.5 V, 1.35 V
[Module timing]
Minimum SDRAM Cycle Time (tCKmin): 1.071 ns
CAS# Latencies Supported: 6, 7, 8, 9, 10, 11
Minimum CAS# Latency Time (tAAmin): 13.125 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
Minimum Row Precharge Time (tRPmin): 13.125 ns
Minimum Active to Precharge Time (tRASmin): 35.000 ns
Supported Module Timing at 800.0 MHz: 11-11-11-28
Supported Module Timing at 666.7 MHz: 9-9-9-24
Supported Module Timing at 533.3 MHz: 7-7-7-19
Supported Module Timing at 400.0 MHz: 6-6-6-14
Minimum Write Recovery Time (tWRmin): 15.000 ns
Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
Minimum Active to Active/Refresh Time (tRCmin): 48.125 ns
Minimum Refresh Recovery Time Delay (tRFCmin): 260.000 ns
Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
[Features]
Partial Array Self Refresh (PASR): Supported
On-die Thermal Sensor (ODTS) Readout: Not Supported
Auto Self Refresh (ASR): Not Supported
Extended Temperature 1X Refresh Rate: Not Supported
Extended Temperature Range: Supported
Module Temperature Sensor: Not Supported
Pseudo Target Row Refresh (pTRR): Not Supported
Module Nominal Height: 29 - 30 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Row: 1 [BANK 0/ChannelA-DIMM0] - 8 GB PC3-12800 DDR3 SDRAM Kingston KHX318LS11IB/8
[General Module Information]
Module Number: 1
Module Size: 8 GBytes
Memory Type: DDR3 SDRAM
Module Type: SO-DIMM
Memory Speed: 800.0 MHz (DDR3-1600 / PC3-12800)
Module Manufacturer: Kingston
Module Part Number: KHX318LS11IB/8
Module Revision: 0
Module Serial Number: 3577020552 (880035D5)
Module Manufacturing Date: Year: 2024, Week: 9
Module Manufacturing Location: 0
SDRAM Manufacturer: Kingston
Error Check/Correction: None
[Module characteristics]
Row Address Bits: 16
Column Address Bits: 10
Number Of Banks: 8
Module Density: 4096 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Module Nominal Voltage (VDD): 1.5 V, 1.35 V
[Module timing]
Minimum SDRAM Cycle Time (tCKmin): 1.250 ns
CAS# Latencies Supported: 6, 7, 8, 9, 10, 11
Minimum CAS# Latency Time (tAAmin): 13.125 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
Minimum Row Precharge Time (tRPmin): 13.125 ns
Minimum Active to Precharge Time (tRASmin): 35.000 ns
Supported Module Timing at 800.0 MHz: 11-11-11-28
Supported Module Timing at 666.7 MHz: 9-9-9-24
Supported Module Timing at 533.3 MHz: 7-7-7-19
Supported Module Timing at 400.0 MHz: 6-6-6-14
Minimum Write Recovery Time (tWRmin): 15.000 ns
Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
Minimum Active to Active/Refresh Time (tRCmin): 48.125 ns
Minimum Refresh Recovery Time Delay (tRFCmin): 260.000 ns
Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
[Features]
Partial Array Self Refresh (PASR): Supported
On-die Thermal Sensor (ODTS) Readout: Not Supported
Auto Self Refresh (ASR): Not Supported
Extended Temperature 1X Refresh Rate: Not Supported
Extended Temperature Range: Supported
Module Temperature Sensor: Not Supported
Pseudo Target Row Refresh (pTRR): Not Supported
Module Nominal Height: 29 - 30 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
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